Details

Project Title3D Printed Device with Interlayer Conductors
Track Code2013-004B
Short Description

The University of Texas at El Paso seeks a partner for licensing a 3D device with inter-layer conductors and components. This technology utilizes filaments such as wires and meshes, rather than conductive traces or antenna  wire. Therefore, the interlayer has higher current, conductivity, and durability
capabilities than existing technology.

Abstract

This technology embeds filaments such as wires or meshes into 3D printed
thermoplastic devices. Then an energy source is applied, generating heat,
allowing the formation of 3D structural components, devices, or systems. The filaments can also be connected to other filaments and components.

 
Tags3D circuitry, 3D printing, 3D printing circuitry, Antenna wire, conductive ink, Cured ink, electric, Electrical interconnect, Embedded filament, Embedded mesh, Embedded wire, interconnect, LDS, Laser direct structuring, MID, Molded interconnect device, conductive trace, electronic
 
Posted DateNov 3, 2016 5:07 PM

Researcher

Name
Eric MacDonald
Ryan Wicker
Danny Muse
David Espalin
Francisco Medina

Manager

Name
Melissa Silverstein

Advantages

  • Conductivity & durability comparable to PCBs
  • Passive Thermal Management
  • Improved Mechanical Strength
  • High current capability
  • Reliable

Potential Applications

  • Small satellite systems
  • Compact military hardware
  • Bio-implantable devices
  • Marine sensors
  • Unmanned aerial vehicles (UAVs)
  • Replacement components for electronic systems
  • Disposable floating depth-specific sensor system
  • Metamaterial structures

Contact Information

For more information, please contact UTEP's Office of Technology Commercialization at techtransfer@utep.edu or 915-747-8030

Files

File Name Description
One-Pager for 2013-004 None Download

Intellectual Property

Patent Number Issue Date Type Country of Filing
None None Other Patent None