Details

Project TitleMultilayered 3D-Printed Electronic Circuits
Track Code2016-043
Short Description

The University of Texas at El Paso seeks a partner for licensing a multilayered and 3D printed electronic circuit.

Abstract

The 3D-printed circuit board resolves the difficulties of fabricating a vertical interconnection access and placing a pad on a mid-build 3D printed multi-layered electronic circuit. 3D printers enable the production of electronic circuits by directly adding conductive ink or metal wires as interconnect between components. For the 3D printed circuit to attain the same functionality and interconnect complexity as a traditional circuit board, however, the 3D printed circuit must have a multilayered structure to avoid collisions and improve routability. A multilayered electronic circuit is composed of not only uniplanar conductive connection, but also a VIA (Vertical Interconnection Access) among two or more layers.  Also, many electronic devices are made for surface mounting, so a pad – flush to the surface - must be provided on which the components are mounted. Since conductive inks spread easily on 3D printed surfaces, this invention overcomes the difficulties in configuring a thin pad for mounting components to the surface of the 3D printed circuit board.

 
Tags3D circuitry, 3D circuits, 3D electronics, 3D printing, 3D printing circuitry, Antenna wire, conductive ink, Cured ink, electric, Electrical interconnect, Embedded filament, Embedded mesh, Embedded wire, interconnect, conductive trace, electronic, vertical interconnection access, Additive Manufacturing, layered manufacturing, rapid prototyping, layer-wise fabrication, solid freeform fabrication, direct digital manufacturing
 
Posted DateNov 14, 2016 5:05 PM

Researcher

Name
Eric MacDonald
Ryan Wicker
David Espalin
Chi Yen Kim

Manager

Name
Melissa Silverstein

Advantages

  • Easily creates a pad for mounting electronics.
  • Produces a vertical interconnection access for improved multilayered functionality.
  • Pin insertion during printing to enclose vertical interconnection access within board.

Potential Applications

  • Automotive
  • Aerospace
  • Consumer Electronics
  • 3D Printed Electronics

Contact Information

For more information, please contact UTEP's Office of Technology Commercialization at techtransfer@utep.edu or 915-747-8030

Files

File Name Description
One-Pager for 2016-043 None Download

Intellectual Property

Patent Number Issue Date Type Country of Filing
None None Other Patent None