Details

Project TitleWire Bonding Embedding in 3D Printed Substrates
Track Code2016-018
Short Description

The University of Texas at El Paso seeks a partner for licensing a system for wire bonding that connects metal pins in 3D printed substrates. The system allows isolated metal structures to be electronically and mechanically interconnected for improved system integration.

Abstract

Wire bonding is used to ultrasonically connect metal foils, while creating a reservoir by 3D printing polymer as a levee. By providing a levee around the arching wire, the levee is later filled with liquid curable polymer.  The wire can be set permanently in this levee and protected during further fabrication. Patent pending.

 
Tagswiring, wire curing, wire bond, Ultrasonic, three-dimensional wiring, three-dimensional circuitry, three dimensional wiring, three dimensional circuitry, thermally-curable media, stereolithography, signal trace, rapid prototyping, polymer, metallic pins, metal structures, mechanical systems, levee, layered manufacturing, integrated systems, integrated, engineering, Embedded, embed, electrical systems, direct write technology, defense, conductive trace, component pins, circuitry, circuit, aerospace, Additive Manufacturing, 3D printing, 3D circuitry, 3D circuits
 
Posted DateApr 6, 2016 11:34 AM

Researcher

Name
Eric MacDonald
David Espalin
Ryan Wicker

Manager

Name
Melissa Silverstein

Advantages

  • Complete spatial control of material
  • Fully customizable
  • High value multi-functional products
  • Connection and conductivity between layers

Potential Applications

  • Biomedical
  • Aerospace
  • Defense industries
  • System integration
  • Consumer electronics

Contact Information

For more information, please contact UTEP's Office of Technology Commercialization at techtransfer@utep.edu or 915-747-8030

Files

File Name Description
One-Pager for 2016-018 None Download

Intellectual Property

Patent Number Issue Date Type Country of Filing
None None Other Patent None