Details

Project TitleWire Spanning Connections of 3D Printed Substrates
Track Code2016-017
Short Description

The University of Texas at El Paso seeks a partner for licensing wire spanning to connect metal foils/wires between layers in 3D printed substrates. The system allows multiple layers to be electronically and mechanically interconnected for improved system integration. 

Abstract

This technology provides an effective connection between conductive traces and surfaces at different layers of the 3D printed dielectric substrate.  Traces and surfaces are also connected to metallic pins of components at various layers in the substrate.  By spanning a void to serve as a via in the interlayer dielectric, connection of two layers of conductors with conductive inks is facilitated. Patent pending.

 
Tagselectrical systems, mechanical systems, metallic pins, substrate, dielectric, wire spanning, wire curing, 3D circuits, thermally-curable media, stereolithography, rapid prototyping, integrated systems, integrated, embed, direct write technology, defense, circuit, aerospace, 3D printing, Additive Manufacturing, layered manufacturing, wiring, circuitry, conductive trace, three dimensional wiring, signal trace, three-dimensional circuitry, three dimensional circuitry, 3D circuitry, three-dimensional wiring
 
Posted DateApr 6, 2016 11:00 AM

Researcher

Name
Eric MacDonald
Ryan Wicker
David Espalin
Isaac Varela

Manager

Name
Melissa Silverstein

Advantages

  • Complete spatial control of material
  • Fully customizable
  • High value
  • Multi-functional products

Potential Applications

  • Biomedical
  • Aerospace
  • Defense industries
  • System integration
  • Consumer electronics

Contact Information

For more information, please contact UTEP's Office of Technology Commercialization at techtransfer@utep.edu or 915-747-8030

Files

File Name Description
One Pager for 2016-017 None Download

Intellectual Property

Patent Number Issue Date Type Country of Filing
None None Other Patent None